A method is presented for studying bonded assemblies under pure mode III loading. It is based upon a novel fixture that can be mounted on a common universal testing machine and is able of realizing pure anti-plane shear conditions. Twisting of the bonded assembly generates a smoothly propagating circular crack front that allows for accurate measurements during the test. Data reduction is carried out based on the global load-displacement response and material properties are identified. Results are presented that demonstrate the capabilities of the proposed approach to provide mode III fracture parameters of adhesively bonded joints.

A novel fixture for measuring mode III toughness of bonded assemblies

CRICRI', Gabriele;PERRELLA, MICHELE;SESSA, SALVATORE;valoroso, nunziante
2015-01-01

Abstract

A method is presented for studying bonded assemblies under pure mode III loading. It is based upon a novel fixture that can be mounted on a common universal testing machine and is able of realizing pure anti-plane shear conditions. Twisting of the bonded assembly generates a smoothly propagating circular crack front that allows for accurate measurements during the test. Data reduction is carried out based on the global load-displacement response and material properties are identified. Results are presented that demonstrate the capabilities of the proposed approach to provide mode III fracture parameters of adhesively bonded joints.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11386/4663374
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